Technical Datasheet & Specifications
CYCLOTENE™ Photosensitive Dielectric Series (4000, 6800, XP-80)
I-line photosensitive Photo BCB formulations designed for RDL, passivation, and high-frequency applications. The 6800 series supports 2.38% standard TMAH developer with low-temperature curing, while XP-80 is self-priming with ultra-low loss.
4000 & 6800 Series Features
- Dielectric constant (Dk): 2.65 / Dissipation factor (Df): 0.0008
- 6800 Series: High resolution (~1.5:1 Aspect Ratio), 2.38% TMAH, Low Temp Curable
- Tg >350 °C / Ultra-low moisture absorption (<0.2%)
CYCLOTENE™ XP-80 (Self-priming)
- Self-priming: Eliminates AP3000 adhesion promoter pre-treatment
- Low Temperature Curable (200 °C): Compatible with thermal-sensitive devices
- Ultra-Low Loss properties optimized for High Speed / High Frequency applications
Photo-BCB Product Specifications Table
| Product Family | Tone / Developer | Key Features & Thickness Range |
|---|---|---|
| CYCLOTENE™ 4000 series | Negative / DS2100, DS3000 | Low Dk/Df, 0.8µm – 30µm thickness |
| CYCLOTENE™ 6800 series | Negative / 2.38% TMAH | High resolution (~1.5:1 AR), Low Temp Curable |
| CYCLOTENE™ XP-80 | Negative / PGMEA | Self-priming, Low Dk/Df, Low Temp Curable (200°C) |
CYCLOTENE™ 3000 & 3300 Non-photosensitive Series (3D-IC Bonding)
Non-photosensitive resins designed for 3D-IC, permanent and temporary wafer bonding. The 3300 series features self-priming chemistry to eliminate separate promoter coating steps.
CYCLOTENE™ 3000 Series
- Broad cure/process window, HF vapor selective dry etch
- 3022-35 (14cSt), 3022-46 (52cSt), 3022-57 (259cSt), 3022-63 (870cSt)
- Degree of planarization >90% and high thermal stability up to 350°C
CYCLOTENE™ 3300 Series (Self-priming)
- Self-priming: Direct coating without AP3000 primer pre-treatment
- Target for Polymer Hybrid Bonding application
- Identical Low Dk (2.65), Low Df (0.0008), and high mechanical reliability
CYCLOTENE™ DF6800 & DF6800M Series (BCB Dry Film Dielectric)
BCB-based photosensitive dielectric dry film (DF-PID) for Glass Core Substrates, FOPLP, and Embedded Die Substrates. Provides exceptional planarization in TGV filling and fine-pitch RDL build-up.
Key Applications
- Glass Core Substrate: TGV filling (dia 100µm / thick 400µm) & 6L-RDL build-up
- FOPLP: Large panel (650x650mm) lamination with high uniformity
- Embedded Die Substrate: Deep trench and cavity filling without voiding
Key Technical Specs
- Tone / Developer: Negative / 2.38% TMAH Standard Developer
- High Resolution: ~2:1 Aspect Ratio
- Reduced exposure dose & shorter develop time for high manufacturing throughput
CYCLOTENE™ BF5000 Series (Dispensing & Bevel Fill)
Solvent-free syringe dispensable liquid BCB formulation developed for 3D-IC packaging and wafer edge bevel fill processes.
Features & Advantages
- Syringe Type Dispensing: Controllable viscosity & precision quantitative dispensing
- Solvent-free: Zero solvent eliminates outgassing and voiding
- Self-priming: Forms superior 3D adhesion without separate primer
3D-IC Bevel Fill Application
Reinforces wafer edges during Wafer-to-Wafer and Chip-to-Wafer back-grinding processes to prevent edge chipping and significantly improve production yield.
DuPont™ Cyclotene™ Adhesion Promoter Solutions (AP3000 & AP8000)
Organosilane primer solutions engineered to maximize interfacial adhesion between Cyclotene™ BCB resins and various substrates (Al, Cu, Ti, SiO2, SiNx, Glass). Delivers 5B maximum tape peel adhesion even after 96-hour pressure cooker test (PCT at 121°C / 2atm / 100% RH), and effectively enhances interfacial adhesion with Epoxy Molding Compounds (EMC) and Underfill in advanced semiconductor packaging.
AP3000
- Applicable Substrates: Al, Cu, Ti, SiO2, SiNx all substrates excellent adhesion (K1c > 0.30)
- Epoxy Molding Application: Greatly enhances adhesion for EMC and Underfill encapsulation
- Bake Effect: Hot Plate Bake (≥75°C~100°C) improves AFM uniformity and maintains adhesion for >7 days
- Silane Concentration: 0.24 ~ 0.36% (1-methoxy-2-propanol solution)
AP8000
- Applicable Substrates: Silicon Oxide (SiO2) and Inorganic Glass surfaces
- Epoxy Molding Application: Greatly enhances adhesion for EMC and Underfill encapsulation
- Silane Concentration: 0.096 ~ 0.144% (Ultra-low concentration formulation)
- Precaution: For Aluminum substrates, AP3000 must be used (AP8000 not recommended for Al)
Table 1. Adhesion Promoter Composition & Sales Specifications
| Parameter | AP3000 | AP8000 |
|---|---|---|
| Silane Concentration | 0.24 – 0.36 % | 0.096 – 0.144 % |
| Particles (≥ 0.5 µm) | Max 25 particles/mL | Max 25 particles/mL |
| Metal Impurities (Na, K, Cu, Fe, Ni) | Max 1 ppm each | Max 1 ppm each |
| Total Metals | Max 10 ppm | Max 10 ppm |
| Shelf Life | 2 Years (Ambient Storage) | 2 Years (Ambient Storage) |
CYCLOTENE™ CWG-2000 Core & CWG-2100 Clad (OPTICAL WAVEGUIDE)
High-performance optical waveguide dry film materials designed for next-generation high-speed switch ASICs, CPO, and data center photonics. CWG-2000 serves as Core and CWG-2100 as Bottom/Top Clad.
Optical Performance
- Multi-Mode Loss (@850nm): <0.1 dB/cm (Ultra-low loss)
- Single-Mode Loss (@1310nm): <0.4 dB/cm
- Refractive Index Difference (ΔRI @850nm): Core 1.560 / Clad 1.545
- Tone / Developer: Negative / 2.38% TMAH
Film Specs & Reliability
- Clad Thickness: 20µm, 45µm / Core Thickness: 43µm
- HTHH (85°C, 85% RH) Reliability Testing: Optical loss variation <10% stably maintained
Laird High-Performance TIM Solutions
Global Laird Thermal Interface Materials (TIM) designed to bridge microscopic gaps between heat sources and heatsinks in semiconductor packages, automotive ECUs, and high-performance servers for maximized heat transfer.
1. Laird Tputty™ (Thermal Putty)
- Soft dough-like consistency completely fills irregular gaps and component height variations
- Low Stress: Low hardness prevents damage to sensitive electronic dies during assembly
- Automated dispenser compatible for high-volume automated production
2. Laird Thermal Pad & Gel
- Laird Thermal Pad: Precision sheet format combining thermal conductivity, cushioning, and electrical insulation
- Laird Thermal Gel: Resists pump-out and oil bleeding, easy for maintenance and reworkability
Qnity™ Thermal Management: TIM1 Gels & Lid Seal Adhesives
Qnity TIM1 solutions consist of thermally conductive silicone gels & adhesives and Lid Seal resins developed to buffer against thermal damage and ensure continuous high performance in high-power AI/Cloud, HPC, and 2.5D/3D semiconductor packages.
TIM 1 (Gels & Adhesives)
- High Thermal Conductivity: Thermally conductive filler + thermally stable silicone matrix
- Ultra-Low BLT: Minimizes thermal resistance at low bond line thickness (<50µm)
- High Power Response: Engineered for >100W~1000W high power semiconductors (HPC, AI/Cloud)
Lid Seal Adhesives
- Substrate & Lid Bonding: Firmly attaches between substrate and lid to secure whole package
- Warpage Prevention: Prevents substrate warpage damaged by high thermal operating conditions
- Whole Package Integrity: Protects 2.5D/3D packaging from thermal deformation stress
Semi-PKG Market Trends and TIM1 Requirement
[Figure 1] Semi-PKG Market Trends and TIM1 Requirement
[Figure 2] Qnity TIM1 & Lid Seal Structure & Thermal Principles