Product Overview & Packaging Trends
Qnity TIM1 portfolio features high-thermal-conductivity silicone gels & adhesives and warpage-controlling Lid Seal resins engineered to prevent thermal degradation and ensure sustained peak computing performance in AI/Cloud accelerators, HPC, and 2.5D/3D high-density semiconductor packages.
Composed of thermally conductive fillers in a thermally stabilized silicone matrix, Qnity TIM1 delivers ultra-low thermal resistance at ultra-thin Bond Line Thickness (BLT < 50 µm).
TIM 1 (Gels & Adhesives)
- High Thermal Conductivity: Synergistic blend of high-conductivity fillers and thermal-stable silicone matrix
- Ultra-Low BLT: Minimal chip-to-lid gap (Bond Line Thickness <50 µm) achieving lowest thermal resistance (0.2x-1.0x)
- High Power Capability: Fully responds to >100W - 1000W+ high-power semiconductors (HPC, AI/Cloud accelerators)
Lid Seal Adhesives
- Substrate & Lid Bonding: Provides high structural bonding between package substrates and metal lids
- Warpage Control: Alleviates thermal stress and package warpage during high-temperature operation
- Package Integrity: Protects 2.5D/3D packages from mechanical distortion and stress fractures
Semi-PKG Market Trends and TIM1 Requirements & Architecture Diagrams
[Figure 1] Semi-PKG Market Trends and TIM1 Requirements
[Figure 2] Qnity TIM1 & Lid Seal Application Architecture Diagram (Flip Chip BGA / Heat Sink)
Technical Inquiry & Sample Request: Qnity TIM1 & Lid Seal
Get in touch with our technical sales engineers for datasheets, process guidelines, and sample evaluations.