Product Overview & Core Technology
CYCLOTENE™ BF5000 series is a 100% solvent-free BCB resin engineered for precision syringe dispensing in 3D-IC packaging and wafer edge bevel fill processes.
CYCLOTENE™ BCB Key Performance Metrics
Benchmark vs. Conventional Polyimide (PI)
Dielectric Const. (Dk @1~20GHz)
2.65
22% lower than PI (3.4) (Minimizes RC Delay)
Dissipation Factor (Df @1~20GHz)
0.0008
1/10th of PI (0.01) (Ultra-Low Signal Loss)
Water Absorption (Moisture)
< 0.2%
Prevents dielectric drift from moisture
Thermal Stability (Tg)
> 350 °C
Lead-free solder reflow compatible
Features & Key Benefits
- Syringe Dispensing: High-precision micro-dispensing compatible with automated dispenser tools
- 100% Solvent-Free: Zero solvent evaporation ensures void-free curing without outgassing
- Self-Priming: Robust chemical adhesion to silicon, glass, and metals without separate primer
- Ultra-Low Moisture Absorption: Prevents package expansion and delamination
3D-IC Bevel Fill Edge Reinforcement
During wafer-to-wafer (W2W) and chip-to-wafer (C2W) back-grinding processes, BF5000 fills and reinforces the wafer edge bevel, eliminating edge stress concentration, chipping, and catastrophic wafer cracking.
BF5000 Physical Properties & Process Conditions
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| Property | Specification | Key Highlights |
|---|---|---|
| Delivery System | Syringe for automated dispensing | Directly mounts on automated precision dispensers |
| Solids Content | 100% (Solvent-free) | Minimal shrinkage & zero outgassing voids |
| Cure Temperature | 200 °C - 250 °C | Controlled thermal stress profile |
| Dielectric Constant | 2.65 @ 1 GHz | Retains signature BCB ultra-low Dk performance |
Technical Inquiry & Sample Request: BF5000 (Bevel Fill)
Get in touch with our technical sales engineers for datasheets, process guidelines, and sample evaluations.